Thermal Analysis
نویسندگان
چکیده
منابع مشابه
Thermal Analysis of Tire
One of the great enemies of rubber compounds is heat. Heat will cause chemical and physical degradation of vulcanized rubber as well as a considerable loss in its strength. A major source of heat generation in a tire is due to internal friction resulting from the viscoelastic deformation of the tire as it rolls along the road. Another source of heat generation in a tire is due to its contact fr...
متن کاملThermal Analysis of Tire
One of the great enemies of rubber compounds is heat. Heat will cause chemical and physical degradation of vulcanized rubber as well as a considerable loss in its strength. A major source of heat generation in a tire is due to internal friction resulting from the viscoelastic deformation of the tire as it rolls along the road. Another source of heat generation in a tire is due to its contact fr...
متن کاملMicro-thermal analysis: scanning thermal microscopy and localised thermal analysis.
Micro-thermal analysis combines the imaging capabilities of atomic force microscopy with the ability to characterise, with high spatial resolution, the thermal behaviour of materials. The conventional AFM tip is replaced by a miniature heater/thermometer which enables a surface to be visualised according to its response to the input of heat (in addition to measuring its topography). Areas of in...
متن کاملThermal Analysis & Rheology THERMAL ANALYSIS REVIEW
Modulated DSC (MDSC) can be easily understood by comparing it to its well-established precursor, differential scanning calorimetry (DSC). Conventional DSC is an analytical technique in which the difference in heat flow between a sample and an inert reference is measured as a function of time and temperature as both the sample and reference are subjected to a controlled environment of time, temp...
متن کاملThermal Analysis of Sintered Silver Nanoparticles Film
Thin bonded films have many applications in antireflection and reflection coating, insulating and conducting films and semiconductor industries. Thermal conductivity is one of the most important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. The defects in material...
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ژورنال
عنوان ژورنال: Journal of the Japan Society of Colour Material
سال: 1991
ISSN: 0010-180X
DOI: 10.4011/shikizai1937.64.178